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DPA d:fine™ CORE 6066 Omni Headset Mic, beige, 3 pin LEMO
DPA d:fine™ CORE 6066 Omni Headset Mic, beige, MicroDot
DPA d:fine™ CORE 6066 Omni Headset Mic, beige, TA4F Mini-XLR
With the new d:fine™ CORE 6066 series, DPA presents subminiature headset microphones based on powerful new capsule technology.
Features at a glance
Powerful new core by DPA technology
The capsule of the d:fine™ CORE 6066 subminiature headset microphone has a diameter of just 3 mm, but is as powerful as the larger, award-winning DPA microphones. Despite its small size, it convinces with clarity, consistent performance and robustness. The subminiature microphones feature the new CORE by DPA technology, which minimizes distortion. This results in a clearer, more open sound across the entire dynamic range of the microphone. The new 6066 series microphones have a noise floor of only 26 dB(A) and can better absorb high SPL without distortion.
The protective grid of the capsule is made of stainless steel and is PVD coated. The close-meshed grid is also extremely robust and resistant to moisture and sweat. The microphone cap can be easily removed and cleaned. The new click function (both tactile and audible) on the microphone grid ensures that the grille sits securely on the microphone housing.
Technically mature headband
In addition to the minimum size with maximum sound potential, these microphones also feature a completely redesigned lightweight headband in one size that is comfortable on the ears. Even when worn for a long time, it guarantees comfort without compromising safety. The bracket is made of stainless steel and is PVD coated (Physical Vapor Deposition) for its extremely rugged design. It is resistant to high temperatures, shocks and abrasion.
The headband has a 3-contact gripping system. The handles with three contact points and spring mechanism provide a secure fit under the ears and on the side of the head for added safety. This new headband can be easily adjusted thanks to the two-way adjustable boom system (length and height) with anti-slip mechanism for the headband and slide lock. The new 90° cable management system protects the cable and guides it along the back of the wearer where it is invisible. The cable has a size of cable size of Ø 1.6 mm (0.06 inch). It is extremely durable, does not knot and has a Kevlar core that resists strong pulling.
An adapter system for flexibility
The adapters for wireless systems offer you flexible, simple and inexpensive options. You are no longer tied to a wireless system. If your requirements change, simply replace your adapter instead of buying a completely new microphone.
Technical data
variants
The DPA d:fine™ CORE 6066 subminiature headset microphone is available in the following versions:
DPA d:fine™ CORE 6066 Omni Headset Mic, beige, Mini-Jack
DPA 4088-F Beige
DPA 4488-DC-R-F34, beige, Miniklinke
DPA 4088-DC-A-F34-LH, beige, Miniklinke
Sennheiser HSP 4-EW-3 Condenser Headmic